Vapor chamber

ABSTRACT

A vapor chamber includes an upper plate, a lower plate and a fixing frame. The lower plate is attached on the upper plate. The lower plate includes a raised structure. The fixing frame is attached on the lower plate. The fixing frame includes a hollow portion and at least one fastening part. The raised structure is accommodated within the hollow portion. The fixing frame is helpful for facilitating the manufacturer or the user to directly assemble and fix the vapor chamber on a supporting plate with a heat source. Moreover, due to the fixing frame, the possibility of causing deformation of the vapor chamber is minimized.

FIELD OF THE INVENTION

The present invention relates to a heat dissipation device, and moreparticularly to a vapor chamber

BACKGROUND OF THE INVENTION

A vapor chamber is one of the heat dissipation devices. Generally, aheat source is fixed on a supporting plate, and a lower plate of thevapor chamber is attached on the heat source. However, the slim-typevapor chamber is readily suffered from deformation. It is important tosecurely fix the heat source on the supporting plate and attach thelower plate of the vapor chamber on the heat source while avoidingdeformation of the vapor chamber.

Moreover, it is also important to quickly and easily fix the finalproduct of the vapor chamber on the heat source.

SUMMARY OF THE INVENTION

For solving the drawbacks of the conventional technologies, the presentinvention provides a vapor chamber with a fixing frame. The fixing frameis helpful for facilitating the manufacturer or the user to directlyassemble and fix the vapor chamber on a supporting plate with a heatsource. Moreover, due to the fixing frame, the possibility of causingdeformation of the vapor chamber is minimized.

In accordance with an embodiment of the present invention, a vaporchamber is provided. The vapor chamber includes an upper plate, a lowerplate and a fixing frame. The lower plate is attached on the upperplate. The lower plate includes a raised structure. The fixing frame isattached on the lower plate. The fixing frame includes a hollow portionand at least one fastening part. The raised structure is accommodatedwithin the hollow portion.

In an embodiment, the vapor chamber is in thermal contact with a heatsource, and the heat source is fixed on a supporting plate. The raisedstructure is contacted with the heat source. The fastening part of thefixing frame is fixed on the supporting plate.

In an embodiment, a thermal conduction property of the lower plate issuperior to a thermal conduction property of the upper plate, and thethermal conduction property of the lower plate is superior to a thermalconduction property of the fixing frame.

In an embodiment, a thermal conduction property of the lower plate issuperior to a thermal conduction property of the upper plate, and thethermal conduction property of the upper plate is superior to or equalto a thermal conduction property of the fixing frame.

In an embodiment, a metallic strength of the fixing frame is higher thana metallic strength of the lower plate, and the metallic strength of thefixing frame is higher than or equal to a metallic strength of the upperplate.

In an embodiment, the fixing frame is made of copper alloy, stainlesssteel, plastic steel or aluminum alloy.

In an embodiment, the upper plate is made of copper alloy, and the lowerplate is made of pure copper.

In an embodiment, the fastening part is a male threaded rod, a femalethreaded rod or a threaded hole.

In an embodiment, the fixing frame is a hollow frame with athrough-hole, and the through-hole is the hollow portion.

In an embodiment, the fixing frame has a notch, or the fixing frame isdefined by two individual sub-frames.

In accordance with another embodiment of the present invention, a vaporchamber is provided. The vapor chamber includes an upper plate, a lowerplate and a fixing frame. The lower plate is attached on the upperplate. The fixing frame is attached on the lower plate. The fixing frameincludes a fastening part.

In an embodiment, the vapor chamber is in thermal contact with the heatsource, and the heat source is fixed on a supporting plate. The fixingframe is contacted with the heat source. A heat from the heat source istransferred to the lower plate through the fixing frame. The fasteningpart of the fixing frame is fixed on the supporting plate.

In an embodiment, a thermal conduction property of the lower plate issuperior to a thermal conduction property of the upper plate, and thethermal conduction property of the lower plate is superior to a thermalconduction property of the fixing frame.

In an embodiment, a thermal conduction property of the lower plate issuperior to a thermal conduction property of the upper plate, and thethermal conduction property of the upper plate is superior to or equalto a thermal conduction property of the fixing frame.

In an embodiment, a metallic strength of the fixing frame is higher thana metallic strength of the lower plate, and the metallic strength of thefixing frame is higher than or equal to a metallic strength of the upperplate.

In an embodiment, the fixing frame is made of copper alloy, stainlesssteel, plastic steel or aluminum alloy.

In an embodiment, the upper plate is made of copper alloy, and the lowerplate is made of pure copper.

In an embodiment, the fastening part is a male threaded rod, a femalethreaded rod or a threaded hole.

In an embodiment, the fixing frame is a hollow frame with athrough-hole, and the through-hole is the hollow portion.

In an embodiment, the fixing frame has a notch, or the fixing frame isdefined by two individual sub-frames.

In an embodiment, the vapor chamber further includes a heat conductionblock. The heat conduction block is attached on the lower plate. Theheat conduction block is in thermal contact with a heat source. The heatsource is fixed on a supporting plate. The heat conduction block iscontacted with the heat source. A heat from the heat source istransferred to the lower plate through the heat conduction block. Thefastening part of the fixing frame is fixed on the supporting plate.

In an embodiment, a thermal conduction property of the lower plate orthe heat conduction block is superior to a thermal conduction propertyof the upper plate, and the thermal conduction property of the lowerplate or the heat conduction block is superior to a thermal conductionproperty of the fixing frame.

In an embodiment, a thermal conduction property of the lower plate orthe heat conduction block is superior to a thermal conduction propertyof the upper plate, and a thermal conduction property of the upper plateis superior to or equal to a thermal conduction property of the fixingframe.

In an embodiment, a metallic strength of the fixing frame is higher thana metallic strength of the lower plate, and the metallic strength of thefixing frame is higher than or equal to a metallic strength of the upperplate.

In an embodiment, the fixing frame is made of copper alloy, stainlesssteel, plastic steel or aluminum alloy.

In an embodiment, the upper plate is made of copper alloy, and the lowerplate or the heat conduction block is made of pure copper.

The above objects and advantages of the present invention will becomemore readily apparent to those ordinarily skilled in the art afterreviewing the following detailed description and accompanying drawings,in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic exploded view illustrating a vapor chamber and asupporting plate according to a first embodiment of the presentinvention;

FIG. 1B is a schematic cross-sectional view illustrating the vaporchamber and the supporting plate according to the first embodiment ofthe present invention;

FIGS. 1C, 1D and 1E are schematic perspective views illustrating someexamples of the fixing frame of the vapor chamber according to the firstembodiment of the present invention;

FIG. 2A is a schematic exploded view illustrating a vapor chamber and asupporting plate according to a second embodiment of the presentinvention;

FIG. 2B is a schematic cross-sectional view illustrating the vaporchamber and the supporting plate according to the second embodiment ofthe present invention;

FIG. 3A is a schematic exploded view illustrating a vapor chamber and asupporting plate according to a third embodiment of the presentinvention;

FIG. 3B is a schematic cross-sectional view illustrating the vaporchamber and the supporting plate according to the third embodiment ofthe present invention; and

FIGS. 3C, 3D and 3E are schematic perspective views illustrating someexamples of the fixing frame of the vapor chamber according to the thirdembodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Please refer to FIGS. 1A and 1B. FIG. 1A is a schematic exploded viewillustrating a vapor chamber and a supporting plate according to a firstembodiment of the present invention. FIG. 1B is a schematiccross-sectional view illustrating the vapor chamber and the supportingplate according to the first embodiment of the present invention.

In this embodiment, the vapor chamber 1 comprises an upper plate 11, alower plate 12 and a fixing frame 13. The vapor chamber 1 is in thermalcontact with at least one heat source 4. The heat source 4 is fixed on asupporting plate 5. After the upper plate 11 and the lower plate 12 ofthe vapor chamber 1 are attached on each other, a working space 14 isdefined. In the working space 14, a first capillary structure 15 isformed on an inner surface of the upper plate 11, and a second capillarystructure 16 is formed on an inner surface of the lower plate 12.Moreover, a support structure 17 is clamped between the upper plate 11and the lower plate 12.

In this embodiment, at least one raised structure 121 is formed on aportion of the lower plate 12. The raised structure 121 is in thermalcontact with the at least one heat source 4. In this context, thethermal contact between the raised structure 121 and the heat source 4indicates that the raised structure 121 is directly attached on the heatsource 4 or an intermediate medium (a thermal grease or another heatconductive element) is arranged between the raised structure 121 and theheat source 4. The arrangement of the raised structure 121 has thefollowing advantages. When the vapor chamber 1 is in thermal contactwith the heat source 4, there is a height difference between the raisedstructure 121 and the other region of the lower plate 12. Consequently,the electronic components on the supporting plate 5 are not pressed orobstructed by the lower plate 12, and the installing flexibility andconvenience are enhanced.

The fixing frame 13 is attached on the lower plate 12 through a weldingmeans or any other appropriate connecting means. When the fixing frame13 and the supporting plate 5 are combined together, the raisedstructure 121 provides a pressing force to suppress the heat source 4.Consequently, the heat energy generated by the heat source 4 can bequickly and completely transferred to the raised structure 121. Then,the heat energy is dissipated away through the operations of the vaporchamber 1. In this embodiment, the fixing frame 13 comprises a hollowportion 131 and at least one fastening part 132. Preferably but notexclusively, the raised structure 121 of the lower plate 12 isaccommodated within the hollow portion 131 of the fixing frame 13, orthe raised structure 121 of the lower plate 12 is extended or protrudedout of the hollow portion 131 of the fixing frame 13.

In an embodiment, the fastening part 132 of the fixing frame 13 is fixedon the supporting plate 5. The fastening part 132 of the fixing frame 13is a female threaded rod. The supporting plate 5 has at least oneperforation 51 corresponding to the at least one fastening part 132.After a screw 6 is penetrated through the perforation 51 and tightenedinto the fastening part 132 (e.g., the female threaded rod), the lowerplate 12, the fixing frame 13 and the supporting plate 5 (along with theheat source 4) are combined together. It is noted that numerousmodifications and alterations may be made while retaining the teachingsof the invention. For example, in another embodiment, the fastening part132 of the fixing frame 13 is a male threaded rod, and the supportingplate 5 has at least one perforation 51 corresponding to the at leastone fastening part 132. After the male threaded rod is penetratedthrough the perforation 51, a screw (not shown) is fixed on the malethreaded rod. Consequently, the assembling process is completed. Inanother embodiment, the fastening part 132 of the fixing frame 13 is athreaded hole. After a screw 6 is penetrated through the perforation 51of the supporting plate 5 and tightened into the threaded hole, theassembling process is completed.

In an embodiment, the upper plate 11 is made of copper alloy, the lowerplate 12 is made of pure copper, and the fixing frame 13 is made ofcopper alloy, stainless steel, plastic steel or aluminum alloy. Sincethe thermal conduction property of pure copper is better than thethermal conduction property of copper alloy, the lower plate 12 canreceive the heat energy more efficiently than the upper plate 11. Sincethe upper plate 11 is closer to the site grasped by the user, thethermal conductivity of the upper plate 11 is slightly lower than thethermal conductivity of the lower plate 12. Consequently, when the vaporchamber 1 is applied to a product (e.g., a smart phone), the user feelsthat the touch temperature of the product is not too high and the heatdissipation efficiency is still satisfactory. Since the fixing frame 13is made of copper alloy or stainless steel, the fixing frame 13 hasexcellent metallic strength. In accordance with a feature of the presentinvention, the thermal conduction property of the material of the fixingframe 13 is lower than that of pure copper (i.e., the material of thelower plate 12) but the metallic strength of the fixing frame 13 issuperior to that of the pure copper. Consequently, the vapor chamber 1is not readily suffered from deformation during the assembling process.The thermal conductivity is measured according to the thermalconductivity coefficient. The metallic strength is measured according toVickers hardness, tensile strength or elasticity coefficient.

In accordance with the designing rules of the vapor chamber 1, thethermal conduction property of the lower plate 12 is superior to thethermal conduction property of the upper plate 11, the thermalconduction property of the lower plate 12 is superior to the thermalconduction property of the fixing frame 13, the thermal conductionproperty of the upper plate 11 is superior to or equal to the thermalconduction property of the fixing frame 13, the metallic strength of thefixing frame 13 is higher than (or superior to) the metallic strength ofthe lower plate 12, or the metallic strength of the fixing frame 13 ishigher than (or superior to) the metallic strength of the upper plate11.

Please refer to FIGS. 1A and 1C again. The fixing frame 13 is a hollowframe with a through-hole. That is, the hollow portion 131 is thethrough-hole. Since the raised structure 121 of the lower plate 12 isaccommodated within the hollow portion 131, the overall thickness of thevapor chamber 1 is not increased.

Hereinafter, some variant examples of the hollow portion 131 of thefixing frame 13 will be described with reference to FIGS. 1D and 1E.

As shown in FIG. 1D, the fixing frame 13 is a hollow frame with a notch133. That is, the hollow portion 131 is defined by the notch 133. Theraised structure 121 of the lower plate 12 can be accommodated withinthe hollow portion 131. In other words, the fixing frame 13 is a framewith the notch 133 or a C-shaped frame.

As shown in FIG. 1E, the hollow portion 131 of the fixing frame 13 isdefined by two individual sub-frames 13A and 13B. The raised structure121 of the lower plate 12 can be accommodated within the hollow portion131.

FIGS. 2A and 2B. FIG. 2A is a schematic exploded view illustrating avapor chamber and a supporting plate according to a second embodiment ofthe present invention. FIG. 2B is a schematic cross-sectional viewillustrating the vapor chamber and the supporting plate according to thesecond embodiment of the present invention.

In this embodiment, the vapor chamber 2 comprises an upper plate 21, alower plate 22 and a fixing frame 23. the fixing frame 23 comprises atleast one fastening part 232. The vapor chamber 2 is in thermal contactwith at least one heat source 4. Consequently, the heat energy from theheat source 4 can be transferred to the lower plate 22. The heat source4 is fixed on a supporting plate 5. After the upper plate 21 and thelower plate 22 of the vapor chamber 2 are attached on each other, aworking space 24 is defined. In the working space 24, a first capillarystructure 25 is formed on an inner surface of the upper plate 21, and asecond capillary structure 26 is formed on an inner surface of the lowerplate 22. Moreover, a support structure 27 is clamped between the upperplate 21 and the lower plate 22. In this context, the thermal contactbetween the fixing frame 23 and the heat source 4 indicates that thefixing frame 23 is directly attached on the heat source or anintermediate medium (a thermal grease or another heat conductiveelement) is arranged between the fixing frame 23 and the heat source 4.

The fixing frame 23 is attached on the lower plate 22 through a weldingmeans or any other appropriate connecting means. When the fixing frame23 and the supporting plate 5 are combined together, the fixing frame 23provides a pressing force to suppress the heat source 4. Consequently,the heat energy generated by the heat source 4 can be quickly andcompletely transferred to the lower plate 22 through the fixing frame23. Then, the heat energy is dissipated away through the operations ofthe vapor chamber 2.

In an embodiment, the fastening part 232 of the fixing frame 23 is afemale threaded rod. The supporting plate 5 has at least one perforation51 corresponding to the at least one fastening part 232. After a screw 6is penetrated through the perforation 51 and tightened into thefastening part 232 (e.g., the female threaded rod), the lower plate 22,the fixing frame 23 and the supporting plate 5 (along with the heatsource 4) are combined together. It is noted that numerous modificationsand alterations may be made while retaining the teachings of theinvention. For example, in another embodiment, the fastening part 232 ofthe fixing frame 23 is a male threaded rod and the supporting plate 5has at least one perforation 51 corresponding to the at least onefastening part 232. After the male threaded rod is penetrated throughthe perforation 51, a screw (not shown) is fixed on the male threadedrod. Consequently, the assembling process is completed. In anotherembodiment, the fastening part 232 of the fixing frame 23 is a threadedhole (not shown). After a screw 6 is penetrated through the perforation51 of the supporting plate 5 and tightened into the threaded hole, theassembling process is completed.

In an embodiment, the upper plate 21 is made of copper alloy, the lowerplate 22 is made of pure copper, and the fixing frame 23 is made ofcopper alloy, stainless steel, plastic steel or aluminum alloy. Sincethe thermal conduction property of pure copper is better than thethermal conduction property of copper alloy, the lower plate 22 canreceive the heat energy more efficiently than the upper plate 21. Sincethe upper plate 21 is closer to the site grasped by the user, thethermal conductivity of the upper plate 21 is slightly lower than thethermal conductivity of the lower plate 22. Consequently, when the vaporchamber 2 is applied to a product (e.g., a smart phone), the user feelsthat the touch temperature of the product is not too high and the heatdissipation efficiency is still satisfactory. Since the fixing frame 23is made of copper alloy or stainless steel, the fixing frame 23 hasexcellent metallic strength. In accordance with a feature of the presentinvention, the thermal conduction property of the material of the fixingframe 23 is lower than that of pure copper (i.e., the material of thelower plate 22) but the metallic strength of the fixing frame 23 issuperior to that of the pure copper. Consequently, the vapor chamber 2is not readily suffered from deformation during the assembling process.The thermal conductivity is measured according to the thermalconductivity coefficient. The metallic strength is measured according toVickers hardness, tensile strength or elasticity coefficient.

In accordance with the designing rules of the vapor chamber 2, thethermal conduction property of the lower plate 22 is superior to thethermal conduction property of the upper plate 21, the thermalconduction property of the lower plate 22 is superior to the thermalconduction property of the fixing frame 23, the thermal conductionproperty of the upper plate 21 is superior to or equal to the thermalconduction property of the fixing frame 23, the metallic strength of thefixing frame 23 is higher than (or superior to) the metallic strength ofthe lower plate 22, or the metallic strength of the fixing frame 23 ishigher than (or superior to) the metallic strength of the upper plate21.

Please refer to FIGS. 3A and 3B. FIG. 3A is a schematic exploded viewillustrating a vapor chamber and a supporting plate according to a thirdembodiment of the present invention. FIG. 3B is a schematiccross-sectional view illustrating the vapor chamber and the supportingplate according to the third embodiment of the present invention.

In this embodiment, the vapor chamber 3 comprises an upper plate 31, alower plate 32, a fixing frame 33 and a heat conduction block 38. Thevapor chamber 3 is in thermal contact with at least one heat source 4.The heat source 4 is fixed on a supporting plate 5. After the upperplate 31 and the lower plate 32 of the vapor chamber 3 are attached oneach other, a working space 34 is defined. In the working space 34, afirst capillary structure 35 is formed on an inner surface of the upperplate 31, and a second capillary structure 36 is formed on an innersurface of the lower plate 32. Moreover, a support structure 37 isclamped between the upper plate 31 and the lower plate 32.

In this embodiment, a first surface of the heat conduction block 38 isattached on the lower plate 32 of the vapor chamber 3 through a weldingmeans or any other appropriate connecting means. A second surface of theheat conduction block 38 is in thermal contact with the at least oneheat source 4. In this context, the thermal contact between the heatconduction block 38 and the heat source 4 indicates that the heatconduction block 38 is directly attached on the heat source 4 or anintermediate medium (a thermal grease or another heat conductiveelement) is arranged between the heat conduction block 38 and the heatsource 4. When the heat conduction block 38, the lower plate 32 of thevapor chamber 3 and the heat source 4 are combined together, the heatenergy generated by the heat source 4 is transferred to the vaporchamber 3 through the heat conduction block 38. Then, the heat energy isdissipated away through the vapor chamber 3.

In this embodiment, the fixing frame 33 comprises a hollow portion 331and at least one fastening part 332. The heat conduction block 38 isdisposed within the hollow portion 331. That is, the top surface of theheat conduction block 38 is at the same level with the top surface ofthe fixing frame 33. Consequently, the overall thickness of the vaporchamber 3 is not increased.

In an embodiment, the fixing frame 33 is attached on the lower plate 32through a welding means or any other appropriate connecting means, andthe fixing frame 33 is fixed on the supporting plate 5 through the atleast one fastening part 332. The fastening part 332 of the fixing frame33 is a female threaded rod. The supporting plate 5 has at least oneperforation 51 corresponding to the at least one fastening part 332.After a screw 6 is penetrated through the perforation 51 and tightenedinto the fastening part 332 (e.g., the female threaded rod), the lowerplate 32, the fixing frame 33 and the supporting plate 5 (along with theheat source 4) are combined together. It is noted that numerousmodifications and alterations may be made while retaining the teachingsof the invention. For example, in another embodiment, the fastening part332 of the fixing frame 33 is a male threaded rod and the supportingplate 5 has at least one perforation 51 corresponding to the at leastone fastening part 332. After the male threaded rod is penetratedthrough the perforation 51, a screw (not shown) is fixed on the malethreaded rod. Consequently, the assembling process is completed. Inanother embodiment, the fastening part 332 of the fixing frame 33 is athreaded hole. After a screw 6 is penetrated through the perforation 51of the supporting plate 5 and tightened into the threaded hole, theassembling process is completed.

In an embodiment, the upper plate 31 is made of copper alloy, the lowerplate 32 is made of pure copper, the heat conduction block 38 is made ofpure copper, and the fixing frame 33 is made of copper alloy, stainlesssteel, plastic steel or aluminum alloy. Since the thermal conductionproperty of pure copper is better than the thermal conduction propertyof copper alloy, the heat energy can be transferred from the heat source4 to the lower plate 32 through the heat conduction block 38 moreefficiently and the lower plate 32 can receive the heat energy moreefficiently than the upper plate 31. Since the upper plate 31 is closerto the site grasped by the user, the thermal conductivity of the upperplate 31 is slightly lower than the thermal conductivity of the lowerplate 32. Consequently, when the vapor chamber 3 is applied to a product(e.g., a smart phone), the user feels that the touch temperature of theproduct is not too high and the heat dissipation efficiency is stillsatisfactory. Since the fixing frame 33 is made of copper alloy orstainless steel, the fixing frame 33 has excellent metallic strength. Inaccordance with a feature of the present invention, the thermalconduction property of the material of the fixing frame 33 is lower thanthat of pure copper (i.e., the material of the lower plate 32) but themetallic strength of the fixing frame 33 is superior to that of the purecopper. Consequently, the vapor chamber 3 is not readily suffered fromdeformation during the assembling process. The thermal conductivity ismeasured according to the thermal conductivity coefficient. The metallicstrength is measured according to Vickers hardness, tensile strength orelasticity coefficient.

In accordance with the designing rules of the vapor chamber 3, thethermal conduction property of the lower plate 32 or the heat conductionblock 38 is superior to the thermal conduction property of the upperplate 31, the thermal conduction property of the lower plate 32 or theheat conduction block 38 is superior to the thermal conduction propertyof the fixing frame 33, the thermal conduction property of the upperplate 31 is superior to or equal to the thermal conduction property ofthe fixing frame 33, the metallic strength of the fixing frame 33 ishigher than (or superior to) the metallic strength of the lower plate32, or the metallic strength of the fixing frame 33 is higher than (orsuperior to) the metallic strength of the upper plate 31.

FIG. 3C is a schematic perspective view illustrating the fixing frame ofthe vapor chamber according to the third embodiment of the presentinvention. Please refer to FIGS. 3A and 3C. The fixing frame 33 is ahollow frame with a through-hole. That is, the hollow portion 331 is thethrough-hole. Since the heat conduction block 38 is accommodated withinthe hollow portion 331, the overall thickness of the vapor chamber 3 isnot increased.

It is noted that the examples of the hollow portion 331 are notrestricted. Hereinafter, some variant examples of the hollow portion 331of the fixing frame 33 will be described with reference to FIGS. 3D and3E.

As shown in FIG. 3D, the fixing frame 33 is a hollow frame with a notch333. That is, the hollow portion 331 is defined by the notch 333. Theheat conduction block 38 can be accommodated within the hollow portion331. In other words, the fixing frame 33 is a frame with the notch 333or a C-shaped frame.

As shown in FIG. 3E, the hollow portion 331 of the fixing frame 33 isdefined by two individual sub-frames 33A and 33B. The heat conductionblock 38 can be accommodated within the hollow portion 331.

While the invention has been described in terms of what is presentlyconsidered to be the most practical and preferred embodiments, it is tobe understood that the invention needs not be limited to the disclosedembodiments. On the contrary, it is intended to cover variousmodifications and similar arrangements included within the spirit andscope of the appended claims which are to be accorded with the broadestinterpretation so as to encompass all modifications and similarstructures.

What is claimed is:
 1. A vapor chamber, comprising: an upper plate; alower plate attached on the upper plate, wherein the lower platecomprises a raised structure; and a fixing frame attached on the lowerplate, wherein the fixing frame comprises a hollow portion and at leastone fastening part, and the raised structure is accommodated within thehollow portion.
 2. The vapor chamber according to claim 1, wherein thevapor chamber is in thermal contact with a heat source, and the heatsource is fixed on a supporting plate, wherein the raised structure iscontacted with the heat source, and the fastening part of the fixingframe is fixed on the supporting plate.
 3. The vapor chamber accordingto claim 1, wherein a thermal conduction property of the lower plate issuperior to a thermal conduction property of the upper plate, and thethermal conduction property of the lower plate is superior to a thermalconduction property of the fixing frame.
 4. The vapor chamber accordingto claim 1, wherein a thermal conduction property of the lower plate issuperior to a thermal conduction property of the upper plate, and thethermal conduction property of the upper plate is superior to or equalto a thermal conduction property of the fixing frame.
 5. The vaporchamber according to claim 1, wherein a metallic strength of the fixingframe is higher than a metallic strength of the lower plate, and themetallic strength of the fixing frame is higher than or equal to ametallic strength of the upper plate.
 6. The vapor chamber according toclaim 1, wherein the fixing frame is made of copper alloy, stainlesssteel, plastic steel or aluminum alloy.
 7. The vapor chamber accordingto claim 1, wherein the upper plate is made of copper alloy, and thelower plate is made of pure copper.
 8. The vapor chamber according toclaim 1, wherein the fastening part is a male threaded rod, a femalethreaded rod or a threaded hole.
 9. The vapor chamber according to claim1, wherein the fixing frame is a hollow frame with a through-hole, andthe through-hole is the hollow portion.
 10. The vapor chamber accordingto claim 1, wherein the fixing frame has a notch, or the fixing frame isdefined by two individual sub-frames.
 11. A vapor chamber, comprising:an upper plate; a lower plate attached on the upper plate; and a fixingframe attached on the lower plate, wherein the fixing frame comprises afastening part.
 12. The vapor chamber according to claim 11, wherein thevapor chamber is in thermal contact with the heat source, and the heatsource is fixed on a supporting plate, wherein the fixing frame iscontacted with the heat source, a heat from the heat source istransferred to the lower plate through the fixing frame, and thefastening part of the fixing frame is fixed on the supporting plate. 13.The vapor chamber according to claim 11, wherein a thermal conductionproperty of the lower plate is superior to a thermal conduction propertyof the upper plate, and the thermal conduction property of the lowerplate is superior to a thermal conduction property of the fixing frame.14. The vapor chamber according to claim 11, wherein a thermalconduction property of the lower plate is superior to a thermalconduction property of the upper plate, and the thermal conductionproperty of the upper plate is superior to or equal to a thermalconduction property of the fixing frame.
 15. The vapor chamber accordingto claim 11, wherein a metallic strength of the fixing frame is higherthan a metallic strength of the lower plate, and the metallic strengthof the fixing frame is higher than or equal to a metallic strength ofthe upper plate.
 16. The vapor chamber according to claim 11, whereinthe fixing frame is made of copper alloy, stainless steel, plastic steelor aluminum alloy.
 17. The vapor chamber according to claim 11, whereinthe upper plate is made of copper alloy, and the lower plate is made ofpure copper.
 18. The vapor chamber according to claim 11, wherein thefastening part is a male threaded rod, a female threaded rod or athreaded hole.
 19. The vapor chamber according to claim 11, wherein thefixing frame is a hollow frame with a through-hole, and the through-holeis the hollow portion.
 20. The vapor chamber according to claim 11,wherein the fixing frame has a notch, or the fixing frame is defined bytwo individual sub-frames.
 21. The vapor chamber according to claim 11,wherein the vapor chamber further comprises a heat conduction block,wherein the heat conduction block is attached on the lower plate, theheat conduction block is in thermal contact with a heat source, and theheat source is fixed on a supporting plate, wherein the heat conductionblock is contacted with the heat source, a heat from the heat source istransferred to the lower plate through the heat conduction block, andthe fastening part of the fixing frame is fixed on the supporting plate.22. The vapor chamber according to claim 21, wherein a thermalconduction property of the lower plate or the heat conduction block issuperior to a thermal conduction property of the upper plate, and thethermal conduction property of the lower plate or the heat conductionblock is superior to a thermal conduction property of the fixing frame.23. The vapor chamber according to claim 21, wherein a thermalconduction property of the lower plate or the heat conduction block issuperior to a thermal conduction property of the upper plate, and athermal conduction property of the upper plate is superior to or equalto a thermal conduction property of the fixing frame.
 24. The vaporchamber according to claim 21, wherein a metallic strength of the fixingframe is higher than a metallic strength of the lower plate, and themetallic strength of the fixing frame is higher than or equal to ametallic strength of the upper plate.
 25. The vapor chamber according toclaim 21, wherein the fixing frame is made of copper alloy, stainlesssteel, plastic steel or aluminum alloy.
 26. The vapor chamber accordingto claim 21, wherein the upper plate is made of copper alloy, and thelower plate or the heat conduction block is made of pure copper.